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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

2 012 kr

2 012 kr

Tidligere laveste pris:

2 023 kr

På lager

Fr., 27 juni - to., 3 juli


Sikker betaling

14 dagers åpent kjøp


Selges og leveres av

Adlibris

Produktbeskrivelse

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

Artikkel nr.

93bff4ac-d52f-49f6-ac04-859f5af998be

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

2 012 kr

2 012 kr

Tidligere laveste pris:

2 023 kr

På lager

Fr., 27 juni - to., 3 juli


Sikker betaling

14 dagers åpent kjøp


Selges og leveres av

Adlibris